SEMICONDUCTOR DEVICE, MOUNTING THEREOF AND MOUNTING STRUCTURE

摘要

PROBLEM TO BE SOLVED: To obtain a technique to improve the heat radiation efficiency of a semiconductor device having a package structure, on which a semiconductor chip is mounted on one surface of a wiring board through bump electrodes and resin is charged in the gaps between one surface of the board and the principal plane of the chip. SOLUTION: A semiconductor device having a package structure, on which a semiconductor chip 3 is mounted on one surface of a wiring board 2 through bump electrodes 4 and resin 5 is charged in the gaps between one surface of the board 2 and the principal plane of the chip 3, comprises an aluminium nitride-made flat plate 7 on the opposite back plane of the chip 3 to its principal plane. This plate 7 has a plane size larger than that of the chip 3 and has a fixing region of its one surface which is fixed through a braze 6 to the back plane of the chip 3.