| 摘要 |
PROBLEM TO BE SOLVED: To reduce the number of parts without any need of the base plate of a module assembly by equipping a module structure with circuit formed on an insulating layer covering a metal-made core which is core material, and constituting a circuit substrate on which a hook part partially engaging a housing is formed. SOLUTION: In regard to the cross-sectional structure of a circuit substrate 1, the upper and lower faces of a metal-made core 10 are covered with an insulating layer 11, and a circuit 12 is covered with a resist layer 13 composed of insulating material. A conducting part 16 conducting between the circuits of the upper and lower faces of the substrate 1 is formed to form a through hole 15. A hook part 17 is formed on the circumferential part of the substrate 1, and has a bend part 18 engaging the upper housing and the lower housing of a module. The core 10 of a through hole 30 formed in the substrate 1 is covered with the insulating layer 11, a circuit 31 is formed on the insulating layer 11, and in addition, a resist layer 13 coats the circuit 31. In the through hole 30, the core 10 is not covered with the insulating layer, and the circuit 31 and the core 10 are made to be in conduction state. |
