发明名称 COOLING APPARATUS BY BOILING
摘要 <p>PROBLEM TO BE SOLVED: To realize downsizing by reducing the number of parts. SOLUTION: A coolant reservoir 3 comprises an extrusion member 7 integrally forming a vapor path 9 and a condensed liquid path 10, and a cap 8, provided over the lower-end periphery of the extrusion member 7, communicating with the vapor path 9 and the condensed liquid path 10. An radiator 4 is constituted by providing a connecting member 12 and a plurality of radiation pipes 13 in layer on the upper part of the coolant reservoir 3. The connecting member 12 is partitioned with a separator 18 into an inlet chamber 19 connecting with the vapor path 9 and an outlet chamber 20 connecting with the condensed liquid path 10. Each of the radiation pipes 13 has a communicating part 23 communicating with another radiation pipe 13 at both ends of a coolant path 22. The radiation pipes 13 are layered, with respective communicating parts 23 aligned with each other, on the upper part of the connecting member 12. The coolant paths 22 communicate with each other via communicating openings 23a of the communicating parts 23, and communicate with the inlet chamber 19 via an inlet-side communicating opening 17a of the connecting member 12, thus communicate with the outlet chamber 20 via an outlet-side communicating opening 17b.</p>
申请公布号 JPH09307035(A) 申请公布日期 1997.11.28
申请号 JP19960194238 申请日期 1996.07.24
申请人 DENSO CORP 发明人 CHIYOUGABE HIROYUKI;KAWAGUCHI SEIJI;SUZUKI MASAHIKO;KADOTA SHIGERU
分类号 H01L23/427;(IPC1-7):H01L23/427 主分类号 H01L23/427
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