| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor device with high reliability causing no cracks on an insulating substrate owing to an impact by wire bonding. SOLUTION: In this semiconductor device, a plurality of circuit patterns 102 to 104 of a conductive material are formed on an insulated circuit board 101, electronic elements 105, 106 including semiconductor elements are mounted at least on one circuit pattern of these circuit patterns and electronic elements 105, 106 including semiconductor elements are mounted at least on one circuit pattern of these circuit patterns and electronic elements 105, 106 and the circuit patterns 102 to 104 are connected by wire bonding. In this case, the circuit patterns 102, 104 are so arranged that the substrate exposed part between above circuit patterns 102 and 104 each other excepting a peripheral part of the circuit board 101 may not be straight in line located from end to end of the circuit board 1. Then, in the case that one end of above board exposed part is an end part of the circuit board 101 besides the other end part comes in contact with the circuit patterns 102 and 104, the length of the straight line part of the board exposed part is not to exceed 70% of the length in its straight line direction and while in the case both ends come in contact with the circuit pattern not to exceed 90% of the length of the circuit board 101 in its straight line direction.</p> |
