发明名称 CONDUCTOR PASTE
摘要 PROBLEM TO BE SOLVED: To set the specific resistance of a tungsten conductor paste at 10μΩcm or less when it is baked. SOLUTION: Tungsten particles for use in a conductor paste are made spherical in shape to reduce the possibility that the corners of the particles lock to one another, thereby smoothing the movement of the particles for a better packing property. Further, adjustment of the average particle diameter of the tungsten particles to 0.6μm or less as measured by SEM observing method, combined with the almost spherical particle shape, makes the packing property much higher than before, decreasing voids among the particles. Therefore, the packing ratio of the tungsten after baking can be increased to 94% or higher, and specific resistance after baking can be set to 10μΩcm or less.
申请公布号 JPH09306237(A) 申请公布日期 1997.11.28
申请号 JP19960117286 申请日期 1996.05.13
申请人 SUMITOMO KINZOKU ELECTRO DEVICE:KK 发明人 NISHIJIMA HIDETAKA;ITO KAZUHIKO
分类号 H05K1/09;H01B1/00;H01B1/16;H01B1/22;(IPC1-7):H01B1/22 主分类号 H05K1/09
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