| 摘要 |
PROBLEM TO BE SOLVED: To improve moisture resistance of a plastic package diode. SOLUTION: The plastic package diode has a lead frame plated with Ag such that the dimpling 7 is applied to a chip mounting face and Ag is plated so as to make this face flush with the surface of the lead frame 1. The Ag- plated area is less than the size of a chip 3 to be mounted and the chip is mounted to cover the entire Ag-plated area, without exposing the Ag on the lead frame 1.
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