| 摘要 |
PROBLEM TO BE SOLVED: To provide a compound lead frame capable of being assembled easily, avoiding harmful effects in terms of packaging caused by fatigue of bonding and molding with time and being superior in electrical characteristics. SOLUTION: The lead frame is formed by a heat sink 1, a printed circuit board 5 glued to the heat sink 1, a lead frame 2 connected to the reverse side of the heat sink 1 against the printed circuit board 5. The through hole 5d are made from the side of the lead frame 2 through the side of the heat sink 1 and the lead 2a of the lead frame 2 and the heat sink 1 are electrically connected through the through hole 5b. |
