发明名称 BASE MATERIAL FOR LAID WIRE, LAID WIRE, AND METHOD FOR FORMING LAID WIRE
摘要 PROBLEM TO BE SOLVED: To provide a laid wires base, which enables mechanically performing such work as binding the required number of conductors integrally as the laid wires, and shaping the laid wires to match the shape of a wiring space or securing the wires to the shape. SOLUTION: A laid-wire base 1 is formed by fixing the regularly spaced positions of the required number of conductors 3 by means of bridges 5 made from a synthetic resin, in such a way that the bridges cross the conductors being arranged to extend parallel to one another. Laid wires are formed by curving a deformable part 9, i.e., the portion of the laid-wire base 1 between the two bridges 5, either directly or in such way that it takes the required shape, and then setting the same into a plate shape using a synthetic resin.
申请公布号 JPH09306262(A) 申请公布日期 1997.11.28
申请号 JP19960146818 申请日期 1996.05.15
申请人 SATO SEIKI:KK 发明人 SATO TOSHIOMI
分类号 B29C45/14;B29L31/34;H01B7/00;H01B7/08;H01B13/00;H01B13/012 主分类号 B29C45/14
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