MANUFACTURING WIRING BOARD USING COPPER CONDUCTOR PASTE

摘要

PROBLEM TO BE SOLVED: To suppress the characteristic deterioration of a Cu conductor by screen-printing a wiring pattern of a Cu conductor paste contg. a metal chelating agent on a board and sintering this pattern to form a wiring board. SOLUTION: Ethylcellulose binder and terpineol solvent are mixed to prepare a vehicle, a chelating agent and anti-corrosives are added to it and mixed with an atomized Cu powder of 3μm in mean grain size to prepare a Cu conductive paste contg. the metal chelating agent. It is screen-printed on an alumina board to form a wiring of 100μm wide and 100μm pitch and sintered in a N atmosphere at 950 deg.C peak to form a wiring board. The chelating agent combines with ions to trap them, thereby making it inert to suppress the characteristic deterioration. The chelating agent is to chelate Cu and may be an ethylene diamine tetraacetate type.