发明名称 MEMORY USING DIELECTRIC CAPACITOR ELEMENT AND ITS MANUFACTURE
摘要 PROBLEM TO BE SOLVED: To make it possible to improve the polarizing characteristics of a ferroelectric capacitor element, to reduce the leakage current of the element and to improve the dielectric breakdown voltage by forming the structure of a protective film covering the element in two layers, and forming the upper layer film as an Si oxide film with TEOS as a material with ozone used as an oxidizer. SOLUTION: In a capacitor element (ferroelectric capacitor element) using capacitor protective films 10, 11 having a ferroelectric unit 8 sandwiched between electrodes 7 and 9, the films 10, 11 covering in contact with the element are formed in a two-layer structure. The film 10 is formed as a film 10 formed by a sputtering method or a spin-on-glass(SOG) film except a CVD method. An Si oxide film using tetraethyl orthosilicate(TEOS) is formed thereon as the film 11 at the substrate temperature of 350 to 500 deg.C, and then the film 11 is heat treated at a high temperature. Thus, the deterioration of the ferroelectric capacitor film quality due to the reducing reaction is prevented. Further, the increase in the leakage current or the element is suppressed to prevent the decrease in the dielectric withstand voltage.
申请公布号 JPH09307074(A) 申请公布日期 1997.11.28
申请号 JP19960118916 申请日期 1996.05.14
申请人 NEC CORP 发明人 MATSUKI TAKEO;KAWAHARA JUN
分类号 H01L27/105;H01L21/314;H01L21/316;H01L21/8242;H01L21/8246;H01L27/108;H01L27/115 主分类号 H01L27/105
代理机构 代理人
主权项
地址