| 摘要 |
<p>PROBLEM TO BE SOLVED: To avoid irregular breaking and to prevent the generation of the so-called chipping along the edge of the cut-off line of a semiconductor wafer in contact with a dicing blade by providing a chip preventing part on the position in each semiconductor chip region side in a scribe lien region. SOLUTION: A chip preventing part 12 made of a dual structure of a first trench 10 and a second trench 11 formed outside the trench 10 is provided in an overcoat film 8 of a scribe line region 5. Thus, in the case of dividing a semiconductor wafer 1 by dicing step, any probable chipping can not intrude into a semiconductor chip region 2. Accordingly, when the semiconductor chip is wire-bonded after finishing the dicing step, any short circuit, etc., by the wire in contact with a part of the scribe line as well as the clogging in a dicing blade can be avoided.</p> |
