REFLOW TYPE SOLDERING APPARATUS

摘要

PROBLEM TO BE SOLVED: To remove contaminants such as flux produced during reflow by cooling an exhaust gas below the liquefying or solidifying point of the gasified flux component in solder to liquefy or solidify the gasified component of the flux etc. in the exhaust gas. SOLUTION: Partition plates 13 are disposed in a case 9 to form a zigzag passage to enough mix an exhaust gas 14 sucked from an exhaust suction hole 10 with outside air sucked from outside air suction holes 17 before being exhausted from an exhaust hole 11. The opening areas of the outside air suction holes 17 are adjusted to adjust the suction rate of the outside air so that the gas 14 is mixed with outside airs 16 to cool down below 70 deg.C. Filters 12 may be disposed in the zigzag passage to remove the liquefied or solidified flux component in the sucked exhaust gas below 70 deg.C.