| 摘要 |
PROBLEM TO BE SOLVED: To reduce the number of imperfect articles, by previously automatically inspecting whether the state of die bonding of all light emitting elements is acceptable, by installing a displacement detecting means for detecting whether displacement of the light emitting element in the normal direction of an light emitting axis exists. SOLUTION: A die bonding equipment 1 is provided with a displacement detecting means 2 for detecting whether displacement of a light emitting element (b) in the normal direction of an light emitting axis exists. When the inclination of the light emitting axis of the light emitting element (b) which is detected by the displacement detecting means 2 is in the range of reference value, a controller 30 as a control means judges that the light emitting element (b) is suitably bonded to a stem (a), and a light emitting element (c) is die-bonded to a specified position on the stem (a). When the inclination of the light emitting element (b) is not in the range of the reference value, it is judged that die bonding of the light emitting element (b) to the stem (a) is imperfect, and bonding work is not performed, but a semiconductor component (n) is discharged by discharging mechanism. |
