Kühlsystem für ein Halbleiterelement, Halbleitermodul bestehend aus einem solchen System und ein thermisch leitender Kühlkörper dafür.

摘要

A cooling system for a semiconductor element (2) comprises a heat flow path including a thermally conductive member (3) interposed between a surface of the element (2) and a surface (6a) of a cooling block (6) for conducting heat between them. The member (3) is slidable relative to at least one of the surfaces at a region of sliding contact. To reduce wear, without reducing thermal conductivity, at the region of sliding contact, at least one of the thermally conductive member (3) and the surface contacted thereby carries a fixed thin film (13) comprising fluorine-containing lubricant, of thickness preferably in the range 2 nm to 100 nm. The fluorine-containing lubricant is chemically bonded to the surface carrying it, or alternatively the thin film comprises the fluorine-containing lubricant and a support layer therefor fixed to the surface carrying said thin film, molecules of said lubricant being anchored in the support layer.