| 发明名称 |
PROCESS AND DEVICE FOR FASTENING BONDING WIRES TO BOND LANDS OF A HYBRID CIRCUIT |
| 摘要 |
In order to improve a process and device for fastening bondingwires (20) to bond lands (11) of a hybrid circuit (10) by means of thermocompression bonding, so that rapid fastening of the bonding wires onto the bond lands is possible with a minimum expenditure of energy in the simplest possible way, it is proposed that the bond lands be heated shortly before and/or during welding in a directed manner, by means of heater elements (13) located in the hybrid circuit under the bond lands. |
| 申请公布号 |
WO9744819(A1) |
申请公布日期 |
1997.11.27 |
| 申请号 |
WO1996DE02318 |
申请日期 |
1996.12.04 |
| 申请人 |
ROBERT BOSCH GMBH;HUBER, ELMAR |
发明人 |
HUBER, ELMAR |
| 分类号 |
H01L21/48;H01R43/02;H05K1/02;H05K1/03;H05K1/16;H05K3/32;H05K3/34;H05K3/46 |
主分类号 |
H01L21/48 |
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