Forcibly ventilated cooler device for power semiconductor of electrical machine

摘要

The device includes air guiding ducts which are located near the semiconductor as bores of circular, slotted, or any other cross-section, surface increasing formations for better heat convection may be used. The cooler preferably contains a plate with bores in one or more rows round the semiconductor, which form ducts for the cooling air. The bores can pass through the plate vertically, obliquely or in a curved manner. The duct may be located not only in the plate section for the semiconductor mounting, but also in e.g. the plate sides. The duct location may enable a modular cooler assembly.