| 摘要 |
The die bonding system is provided, which freely enables work regardless of the size of a semiconductor chip and the size of a bonding agent container, and informs ending point of the bonding agent at an optimal time. The die bonding system includes a cylinder resin bonding agent container having a bonding agent for bonding a semiconductor chip to a bonding portion to be bonded, an epoxy dotting unit for providing the resin bonding agent from the resin bonding agent container to the bonding portion to be bonded, a sensing means for sensing charge amount of the bonding agent by light or magnet, and a controller for controlling supply amount of the resin. An epoxy bonding agent is special coated on an inner wall of the bonding agent container to smoothly flow the epoxy bonding agent. A program is provided in the controller, which operates the bonding system if the sensing means senses the epoxy bonding agent while stops the bonding system if the sensing means senses a coin ring or magnet.
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