Etching high aspect contact holes in solid state devices,申请号EP19970103150-传众专利搜索

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发明名称	Etching high aspect contact holes in solid state devices
摘要
申请公布号	EP0797242(A3)	申请公布日期	1997.11.26
申请号	EP19970103150	申请日期	1997.02.26
申请人	SIEMENS AKTIENGESELLSCHAFT;INTERNATIONAL BUSINESS MACHINES CORPORATION	发明人	YANG, CHI-HUA;LAUX, VOLKER B.;GREWAL, VIRINDER S.
分类号	H01L21/28;H01L21/302;H01L21/3065;H01L21/311;H01L21/768;(IPC1-7):H01L21/306	主分类号	H01L21/28
代理机构		代理人
主权项
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