METHOD FOR PACKAGING A SEMICONDUCTOR DEVICE HAVING PROJECTED ELECTRODES

摘要

A method for packaging a semiconductor device having projected electrodes is provided. The method includes the steps of: (a) placing the semiconductor device on a substrate having a plurality of groups of metallic projections formed thereon; (b) bonding electrodes of the semiconductor device with one of the groups of metallic projections at least by pressure so that the bonding strength of the metallic projections with the electrodes is greater than that of the metallic projections with the substrate; (c) repeating steps (a) and (b) until a prescribed number of semiconductor devices are bonded to the substrate through the groups of metallic projections, and transporting the substrate having the plurality of semiconductor devices; (d) transferring each of the groups of metallic projections to the semiconductor device bonded therewith by removing the semiconductor device from the substrate with the group of metallic projections attached to the electrodes of the semiconductor device; (e) placing the semiconductor device with the group of metallic projections attached thereto on a wiring board; and (f) bonding the semiconductor device with the group of metallic projections attached thereto with the wiring board.