发明名称 |
Carrier having slide connectors for testing unpackaged semiconductor dice |
摘要 |
A carrier for testing an unpackaged semiconductor die is provided. The carrier comprises a base for holding the die, an interconnect for establishing a temporary electrical connection with the die, and a force applying mechanism for biasing the die and interconnect together. The base includes external contacts arranged as flat metal pads in a dense grid array and electrically connected to a pattern of contact pads. The carrier also includes a pair of slide connector members which provide an electrical path between the contact pads on the base and corresponding contact pads on the interconnect. The slide connector members can be formed of molded plastic or ceramic and include tine contacts that slidably engage the contact pads on the interconnect and base. The slide connector members permit the interconnect to be easily replaced for testing of different types of dice.
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申请公布号 |
US5691649(A) |
申请公布日期 |
1997.11.25 |
申请号 |
US19960587175 |
申请日期 |
1996.01.12 |
申请人 |
MICRON TECHNOLOGY, INC. |
发明人 |
FARNWORTH, WARREN M.;AKRAM, SALMAN;BROOKS, MIKE |
分类号 |
G01R1/04;G01R1/067;G01R1/073;G01R3/00;G01R31/28;H01L21/60;H01L21/66;H01L21/68;H01L23/13;H01L23/498;H05K3/00;H05K3/42;(IPC1-7):G01R31/02 |
主分类号 |
G01R1/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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