| 摘要 |
PROBLEM TO BE SOLVED: To improve the accuracy of a wafer to be cut by permitting grinding liquid to enter between the work and the wire. SOLUTION: The multiwire saw is constituted such that a multiwire row 3 spread among grooved rollers 1 is traveled in one direction or reciprocation direction, and matter 7 to be cut is subjected to cutting operation in a manner being pressed against the wire row 3 while feeding grinding liquid 4. Every cutting the matter 7 to be cut at a predetermined rate, it is reversed by a smaller rate than the predetermined rate in the counter direction of the cutting direction, and pressed against the cutting direction again repeatedly. |
