| 摘要 |
A fan assembly for an integrated circuit includes a finned plate, a board member securely mounted to the finned plate and including a hole defined in a mediate portion thereof, a fan device, and a heat conducting member. The finned plate includes a plurality of rows and columns of fins extending upwardly from an upper side thereof and a space defined in a center of the upper side, each two adjacent fins having a gap defined therebetween. The fan device is mounted to the board member and has a fan rotatably received in the space of the finned plate. The heat conducting member is securely connected to the finned plate or an integrated circuit.
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