摘要 |
A method in accordance with the present invention includes programming a plurality of semiconductor devices simultaneously, thereby dramatically increasing the number of devices programmed within a predetermined time. In one embodiment, this method includes arranging a first plurality of semiconductor devices into an array configuration. The first array is then programmed while a second plurality of semiconductor devices is arranged into the array configuration. The second array is then programmed, while the first array is unloaded and a third plurality of semiconductor devices is arranged into the array configuration. The present invention further includes the step of moving the first plurality of semiconductor devices in the array configuration to a programming position and the step of transferring the first plurality of semiconductor devices to an unloading position. The steps of moving or transferring includes providing a vacuum, mechanical pick-up, or magnetic pick-up for moving the semiconductor devices. In one embodiment, the step of loading is performed by a first arm capable of three dimensional movement, and the step of unloading is performed by a second arm capable of three dimensional movement independent of the first arm. In this embodiment, the step of moving or transferring is performed with a dual head array mechanism capable of moving independently from the first and second arms.
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