| 摘要 |
PROBLEM TO BE SOLVED: To efficiently clean a metal processing part, a glass processing part, a ceramic processing part, a silicon wafer, etc. SOLUTION: This cleansing composition is composed of 0.2-20 pts.wt. of a nonionic surfactant, 0.1-10 pts.wt. of water and the balance of a nonaqueous solvent based on 100 pts.wt. in total. The cleansing composition has a clouding point in a temperature range from 10 to 90 deg.C, and forms a W/O-type emulsion at temperatures over the clouding point. By using the cleansing composition, a part is cleaned at a temperature over the clouding point of the cleansing composition and the cleansing composition is substituted with a rinsing liquid at a temperature below the clouding point. |
