发明名称 Method of making BiCMOS circuit
摘要 A method of manufacturing an integrated circuit having a buried layer of a low doped type of conductivity (2) and a buried layer of a highly doped type of the same conductivity (3) by masking a substrate (1) so as to define open areas on the substrate where it is desired to provide the two buried layers and doping the open areas of the substrate with a low concentration of dopants to form the low doped type of buried layer (2) is formed. Then one open area where the low doped type of buried layer (2) is formed is masked and the other open area is doped with a high concentration of dopants to form the highly doped type of buried layer (3).
申请公布号 US5691224(A) 申请公布日期 1997.11.25
申请号 US19960668655 申请日期 1996.06.25
申请人 MOTOROLA, INC. 发明人 FOERSTNER, JUERGEN;COMBES, MYRIAM;MARTY-BLAVIER, ARLETTE;HAUTEKIET, GUY
分类号 H01L27/06;H01L21/74;H01L21/8222;H01L21/8248;H01L21/8249;(IPC1-7):H01L21/70 主分类号 H01L27/06
代理机构 代理人
主权项
地址