发明名称 CONDUCTIVE RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To obtain a conductive resin compsn. which can offer a resin product having an excellent antistatic property by incorporating a cationic copolymer having a specific structural unit and a conductive filler into an org. polymer material. SOLUTION: An org. polymer material (A), pref. a thermoplastic resin, is mixed with a cationic copolymer (B), in an amt. of 1 to 10wt.% based on the resin compsn., having a wt. average mol.wt. of 1,000 to 50,000 and comprising 80 to 98mol% structural unit represented by formula I, 0 to 15mol% structural unit represented by formula II (wherein R<1> represents a methyl or ethyl group) and 2 to 20mol% structural unit represented by formula III (wherein R<2> represents an ethylene or propylene group; R<3> and R<4> represent each a methyl group; R<5> represents a lower straight-chain alkyl group or an arylalkyl group; X represents a halogen, CH3 OSO3 , or CH3 CH2 OSO3 ); and 10 to 40wt.% conductive filler (C) having a volume resistivity of 0.1 to 10<4>Ω.cm to obtain a resin compsn. A resin product obtd. from this compsn. has a surface resistivity controlled in the range of 10<10> to 10<18>Ω.
申请公布号 JPH09302247(A) 申请公布日期 1997.11.25
申请号 JP19960123554 申请日期 1996.05.17
申请人 DAI ICHI KOGYO SEIYAKU CO LTD 发明人 SUMI HIDEYUKI;FURUKAWA TAKESHI
分类号 C08K3/00;C08L33/24;C08L101/00;C08L101/12;(IPC1-7):C08L101/12 主分类号 C08K3/00
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