| 摘要 |
PROBLEM TO BE SOLVED: To prevent the occurrence of short circuit between pins of lead frame, etc., and peeling of plating layer and to improve dimensional accuracy and die life at the time of punching. SOLUTION: This copper alloy for electronic equipment is a copper alloy having a composition consisting of, by weight, 0.1-0.4% Cr, 0.05-2.0% Sn, 0.05-2.0% Zn, 0.002-0.2%, in total, of one or more elements among Sr, Ba, and Bi, <0.2% (including 0%) Zr, <0.01% P, <0.005% S, <0.005% O2 , and the balance Cu with inevitable impurities or a copper alloy having a composition consisting of, by weight, 0.1-0.4% Cr, <0.2% Zr, 0.05-2.0% Sn, 0.05-2.0% Zn, 0.002-2.0%, in total, of one or more elements among Sr, Ba, and Bi, <0.01% P, <0.005% S, and <0.005% O2 , and the balance Cu with inevitable impurities. Further, the size of the crystallized substances or precipitates contained in the copper alloy and the crystalline grain size of the copper alloy are regulated to <3μm and <5μm, respectively.
|
