发明名称 Metal heat-sink for electronic module
摘要 The heat sink (1) has a durable protective layer (5) with high thermal and electrical conductivity at least on the heat take-up side (2). The outer side which radiates heat is covered by a coating (6) e.g. powered lacquer, which increases the thermal radiation. The protective layer is applied to all surfaces of the body to form an adhesive layer for the coating. It is a chromatising layer esp. a yellow chromatising layer of thickness between about 100 nanometres and 1 micron.
申请公布号 DE19619060(A1) 申请公布日期 1997.11.20
申请号 DE1996119060 申请日期 1996.05.13
申请人 AUSTERLITZ ELECTRONIC GMBH, 90489 NUERNBERG, DE 发明人 JAENTSCH, THOMAS, 90489 NUERNBERG, DE;LANG, WOLFGANG, 91227 LEINBURG, DE
分类号 F28F13/18;H01L23/373;H01L23/552;H05K7/20;H05K9/00;(IPC1-7):H05K7/20 主分类号 F28F13/18
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