发明名称 |
HIGH-TENSILE ELECTROLYTIC COPPER FOIL AND PROCESS FOR PRODUCING THE SAME |
摘要 |
A high-tensile electrolytic copper foil with its rough surface smoothed and at the same time improved in tensile strength, particularly tensile strength after heating, wherein the surface roughness Rz does not exceed 2.5 mu m and the tensile strength after heating is at least 40 kgf/mm<2>; and a process for producing an electrolytic copper foil, characterized by conducting electrolysis using an electrolyte comprising copper sulfate or sulfuric acid as a main component and further 0.5 to 5.0 g/l of iron ions, 0.01 to 0.10 g/l of a polyether represented by the structural formula (-CH2CH2O-)n, and 0.9 to 1.8 g/l of tin sulfate with the chloride ion concentration being less than 0.1 mg/l. |
申请公布号 |
WO9743466(A1) |
申请公布日期 |
1997.11.20 |
申请号 |
WO1997JP01604 |
申请日期 |
1997.05.13 |
申请人 |
MITSUI MINING & SMELTING CO., LTD. |
发明人 |
SAKAI, HISAO;YOKOTA, TOSHIKO;ASAI, TSUTOMU;TAKAHASHI, SUSUMU;SUZUKI, MITSUO;DOBASHI, MAKOTO;HARA, YASUJI |
分类号 |
C25D1/04;C25D3/38;H05K1/09;(IPC1-7):C25D1/04;H05K3/38 |
主分类号 |
C25D1/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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