Multilayer substrate for printed circuit board

摘要

The substrate includes multiple surface connected insulation layers with at least one inner insulation layer as a distance frame with a window (11). At least on one substrate surface side, and between adjacent insulation layers, are formed contact faces and/or conductive tracks (6-9). At least one inner insulation layer (3) forms a spacer frame with at least one window for an inner electric component (12). Both side of the window are closed by further insulation layers (2,4) adjacent to the spacer frame, whose thickness equals at least the height of the inner component. Preferably a separate window is provided for each electric component.