| 摘要 |
<p>An assembly of an optical component, e.g. a laser diode (1), and an optical waveguide (2), in alignment with each other on a silicon-on-insulator chip which comprises a layer of silicon (7) separated from a substrate (8) by a layer of insulating material (9). A location recess is formed in the chip to receive the laser diode (1). The recess has at least two non-parallel location surfaces (3, 6) and the waveguide is formed on the chip in known alignment with the location surfaces (3, 6). The laser diode (1) has at least two reference surfaces (1A, 1B) and is mounted in the location recess so that the reference surface (1A, 1B) abut against the respective location surfaces (3, 6). The location recess is formed such that the position of one (6) of its location surfaces is determined by the position of the upper or lower interface of the layer of insulating material (9) of the silicon-on-insulator chip.</p> |
