发明名称 Halbleiteranordnung mit einer trichterförmigen Verbindung zwischen Leiter-Ebenen und Verfahren zu ihrer Herstellung
摘要 A semiconductor device has a funnel shaped contact window (30) for providing an inter-level connection between a lower silicon or polysilicon film (22) and an upper metal wiring strip (32), and the funnel shaped contact window is formed in an inter-level insulating film structure (27) consisting of a lower insulating film (28) of phosphosilicate glass and an upper insulating film (29) of silicon dioxide, since an isotropical etching is firstly applied to the silicon dioxide film and followed by an anisotropical etching to the phosphosilicate glass film by using the same mask layer, the lower portion of the contact window is smaller in cross sectional area than the upper portion, and the funnel shaped contact window thus formed is effective to create a smooth topography of an upper metal wiring strip for preventing from undesirable disconnection.
申请公布号 DE69031575(D1) 申请公布日期 1997.11.20
申请号 DE1990631575 申请日期 1990.01.24
申请人 NEC CORP., TOKIO/TOKYO, JP 发明人 YAMAZAKI, YASUSHI, C/O NEC CORPORATION, TOKYO, JP
分类号 H01L21/3205;H01L21/28;H01L21/768;H01L23/522;(IPC1-7):H01L23/485;H01L21/320 主分类号 H01L21/3205
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