A circuit board is disclosed comprising a substantially non-conductive substrate (12) and first and second rigid sheets (14, 16). The first sheet (14) forms a grid pattern substantially encapsulated by the substrate (12), and a portion (20) of the first sheet extends beyond a boundary of the substrate to form a first interconnection terminal. The second sheet (16) is also substantially encapsulated by the substrate (12) and has a portion which extends beyond the boundary of the substrate (12) to form a second interconnection terminal. The second sheet (16) acts as an electromagnetic interference shield, and also has a coefficient of thermal expansion less than a coefficient of thermal expansion of the substrate (12).
申请公布号
WO9743882(A1)
申请公布日期
1997.11.20
申请号
WO1997GB01188
申请日期
1997.05.01
申请人
FORD MOTOR COMPANY LIMITED;FORD WERKE AG;FORD FRANCE S.A.;FORD MOTOR COMPANY;FORD MOTOR COMPANY OF CANADA LIMITED
发明人
GLOVATSKY, ANDREW, ZACHARY;TODD, MICHAEL, GEORGE;MCMILLAN, RICHARD, KEITH, II