| 摘要 |
<p>A microelectronic package (100) suitable for high-frequency microelectronic devices (116) includes a base (102) which is at least partially conductive attached to an RF substrate (106) with a cavity formed at its center and a pattern of conductive paths (122) for providing interconnection from the inside to the outside of the package. The base may be metal or ceramic with a metal layer deposited thereon. A sealing cap (114) is attached to the RF substrate by a non-conductive adhesive, such as a polymer adhesive (112) of low temperature seal glass, to seal the package once the microelectronic device has been mounted inside.</p> |
