发明名称 |
Conformal thermal interface material for electronic components |
摘要 |
A thermally-conductive interface for conductively cooling a heat-generating electronic component having an associated thermal dissipation member such as a heat sink. The interface is formed as a self-supporting layer of a thermally-conductive material which is form-stable at normal room temperature in a first phase and substantially conformable in a second phase to the interface surfaces of the electronic component and thermal dissipation member. The material has a transition temperature from the first phase to the second phase which is within the operating temperature range of the electronic component. |
申请公布号 |
AU1807797(A) |
申请公布日期 |
1997.11.19 |
申请号 |
AU19970018077 |
申请日期 |
1997.02.14 |
申请人 |
PARKER-HANNIFIN CORPORATION |
发明人 |
MICHAEL H BUNYAN;MIKSA DE SORGO |
分类号 |
H01L23/36;C09K5/00;C09K5/06;H01L23/373 |
主分类号 |
H01L23/36 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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