| 摘要 |
The apparatus includes, e.g. multiple power semiconductor diodes or GTO thyristors (E), alternating with heat sinks (R) along a common axis. The power semiconductors are held by a one gripper system (1) against a baseplate (8), and protective diodes (P) are held against the other side of the baseplate by a second gripper system (2) and two screws (12) through a positioning plate (11). The semiconductors are isolated from the framework by wedges (3-6). Any heat sinks not required for a specific application, e.g. invertor or auxiliary chopper, are replaced by a conductive block (7) of e.g. aluminium. |
