发明名称 Coils for generating a plasma and for sputtering
摘要 A sputtering coil for a plasma chamber (100) in a semiconductor fabrication system is provided. The sputtering coil (104) couples energy into a plasma and also provides a source of sputtering material to be sputtered onto a workpiece (112) from the coil to supplement material being sputtered from a target (110) onto the workpiece. Alternatively a plurality of coils may be provided, one primarily for coupling energy into the plasma and the other primarily for providing a supplemental source of sputtering material to be sputtered on the workpiece. <IMAGE>
申请公布号 EP0807954(A1) 申请公布日期 1997.11.19
申请号 EP19970303124 申请日期 1997.05.08
申请人 APPLIED MATERIALS, INC. 发明人 NULMAN, JAIM;EDELSTEIN, SERGIO;SUBRAMANI, MANI;XU, ZENG;GRUNES, HOWARD;TEPMAN, AVI;FORSTER, JOHN;GOPALRAJA, PRABURAM
分类号 C23C14/34;H01J37/34;H01L21/203 主分类号 C23C14/34
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