发明名称
摘要 PURPOSE:To reduce a high-sensity wiring part and the impedance of a wiring part by constituting the following: circuit patterns arranged and formed respectively on both main faces of the surface and the rear of an insulating board; and a printed conductor connection pattern which connects the circuit patterns on both main faces electrically at the side face of the insulating board. CONSTITUTION:When a roll-shaped rotary body 1 is rotated clockwise by a very small angle theta, a very small reservoir 2' of a paste 2 is formed on the surface 3a of a wiring board 3, and a very small overlap part is formed on the end part of an opposite circuit pattern which has been formed on the surface 3a and which is to be connected. Then, the rotary boady is rotated counterclockwise by theta and is returned to its original state; the circuit pattern on the surface 3a and an overlapped paste are adapted; after that, the rotary body is again rotated counterclockwise by theta; the very small reservoir 2' of the wiring paste 2 is formed on the rear 3b of the wiring board 3; a very small overlap part is formed on the end part of an opposite circuit pattern which has been formed on the rear 3b and which is to be connected. The rotary body is returned clockwise by theta, and the pattern on the rear 3b and the overlapped paste and are adapted. One side face of the wiring board 3 and the circuit patterns on both the surface and the rear can be connected surely through a very small quantity of paste 2.
申请公布号 JP2680153(B2) 申请公布日期 1997.11.19
申请号 JP19900021764 申请日期 1990.01.31
申请人 发明人
分类号 B41J2/345;H05K1/11;H05K3/40;H05K3/46;(IPC1-7):H05K3/40 主分类号 B41J2/345
代理机构 代理人
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