Plastic molded type semiconductor device and method of manufacturing the same

摘要

Disclosed herein are a plastic molded type semiconductor device and a method of manufacturing the semiconductor device. The semiconductor device comprises a semiconductor element having electrodes provided on a surface thereof, a dambar formed along the outer periphery of the surface of the semiconductor element, a plurality of leads respectively electrically connected to the electrodes and provided inside the dambar electrically independent of the dambar, and a mold resin formed within a region surrounded by the dambar and formed so as to expose parts of the leads.