SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF

摘要

PROBLEM TO BE SOLVED: To prevent adhesion of molten solder to the surface of a pellet and a collet. SOLUTION: A step concave portion 12 is provided at a region, where a pellet 13 is connected, in a header 10 of a power transistor 22. The step concave portion 12 has a first concave portion 12a having a width greater than that of the pellet 13 and a depth less than that of the pellet 13, a second concave portion 12b, formed on the bottom surface of the first concave portion 12a, having a width less than that of the pellet 13, and a third concave portion 12c, formed on the bottom surface of the second concave portion 12b. The step concave portion 12 is filled with molten solder, then the pellet 13 is placed on the molten solder by the collet, and the pellet 13 is bonded to the header 10 by a solder layer 14 formed in the step concave portion 12. This prevents the molten solder from rising around the pellet 13, which prevents adhesion of the molten solder to the pellet and the collet.