发明名称 |
Multi-chip device and method of fabrication employing leads over and under processes |
摘要 |
A device and method for increasing integrated circuit density comprising a pair of superimposed dies with a plurality of leads extending between the dies. The device is produced by providing a lower die which has a plurality of bond pads on a face side of the lower die. A layer of dielectric or insulative shielding is applied over the lower die face side. Leads are applied to an upper surface of the shielding layer. A plurality of lower die bond wires is attached between the lower die bond pads and an upper surface of their respective leads. A second layer of dielectric or insulative shielding is applied over the leads and the portion of the lower die bond wires extending over the lead upper surfaces. A back side of the upper die is adhered to an upper surface of the second shielding layer. A plurality of upper die bond wires are attached between a plurality of bond pads on a face side of the upper die and the upper surface of their respective leads.
|
申请公布号 |
US5689135(A) |
申请公布日期 |
1997.11.18 |
申请号 |
US19950574994 |
申请日期 |
1995.12.19 |
申请人 |
MICRON TECHNOLOGY, INC. |
发明人 |
BALL, MICHAEL B. |
分类号 |
H01L25/18;H01L23/495;H01L23/50;H01L25/065;H01L25/07;(IPC1-7):H01L23/495;H01L23/34 |
主分类号 |
H01L25/18 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|