发明名称 |
Electrical trace interconnect assembly |
摘要 |
A trace interconnect assembly for transmitting electrical signals to and from a head assembly in a hard disk drive. The interconnect assembly includes one or more single-layer thin, elongated, and generally flat substrate-free trace interconnects. The trace interconnects are new conductors etched out of a planar length of preferably a high tensile and high yield strength metal such as beryllium copper. They are shaped to match the surface topology of the suspension assembly. Trace interconnects have a rigid region and flexible regions that match a rigid region and flexible regions in the suspension assembly. Different additional elements include support braces, standoffs, trace tangs, bond pads, and stacked interconnects. Coupling a head assembly to the interconnect assembly creates a head interconnect harness. Methods of manufacture for the trace interconnect assembly, a multi-conductor stacked version, a head suspension assembly, and the head interconnect harness are disclosed.
|
申请公布号 |
US5687479(A) |
申请公布日期 |
1997.11.18 |
申请号 |
US19960634972 |
申请日期 |
1996.04.19 |
申请人 |
HUTCHINSON TECHNOLOGY INCORPORATED |
发明人 |
BENNIN, JEFFRY S.;BOUCHER, TODD;GREEN, JEFFREY W.;GUSTAFSON, GARY E.;JURGENSON, RYAN;LIEN, BRENT D. |
分类号 |
G11B5/60;G11B5/48;G11B21/21;H05K1/09;H05K1/11;H05K3/00;H05K3/06;H05K3/20;H05K3/36;(IPC1-7):H01R43/16 |
主分类号 |
G11B5/60 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|