发明名称 WIRE BONDING CAPILLARY
摘要 PROBLEM TO BE SOLVED: To realize a wire bonding capillary which restrains a a bonding failure from occurring in a gold wire and is enhanced in bonding frequency so as to be improved in production efficiency by a method wherein organic lubricant is applied to the inner face of a wire feeder fine hole of the wire bonding capillary and the outermost edge face of the capillary tip. SOLUTION: A wire bonding machine is equipped with a wire bonding capillary, where organic lubricant is applied to the inner face of a wire feeder fine hole provided to the wire bonding capillary and the outside of the tip of the capillary. The organic lubricant is formed of grease whose main component is paraffin hydrocarbon, naphthene hydrocarbon or aromatic hydrocarbon or a mixture of them. A capillary 1 whose surface is all coated with organic lubricant 3 or where organic lubricant is applied onto the inner side of its wire feeder fine hole 2 and the outermost edge face 4' of its tip 4 or where organic lubricant is applied onto the inner side of its wire feeder fine hole 2 and its tip 4 is used.
申请公布号 JPH09298214(A) 申请公布日期 1997.11.18
申请号 JP19960112363 申请日期 1996.05.07
申请人 MITSUBISHI MATERIALS CORP 发明人 OOMURA TOSHIMASA
分类号 H01L21/60 主分类号 H01L21/60
代理机构 代理人
主权项
地址