CERAMIC CIRCUIT BOARD AND SEMICONDUCTOR DEVICE USING THE BOARD

摘要

PROBLEM TO BE SOLVED: To prevent breakage of a joint portion and separation of the joint portion from a packaging substrate due to a thermal stress derived from the difference between a thermal expansion coefficient of the packaging substrate and that of a ceramic substrate when a semiconductor device is packaged. SOLUTION: A predetermined wiring pattern 34 is formed on a ceramic substrate 32 for connecting external connection terminals. An insulating buffer layer 40, having a Young's modulus less than that of ceramic material, of the ceramic substrate 32 and electric insulating characteristic, is formed on the packaging surface side of the ceramic substrate 32. Terminal pads 14 are provided on the surface of the insulating buffer layer 40. The terminal pads 14 and the wiring pattern 34 are electrically connected via a buffer conductive member 42 having substantially the same Young's modulus as that of the insulating buffer layer 40.