| 摘要 |
Probes include proximal ends electrically connected to the respective conductive patterns of said insulating substrate, and free ends for being contact with the respective electrode pads of the object. The probes can be buckled in such a manner that the free ends are brought into contact with the respective electrode pads of the object under a predetermined contact pressure. Probes are formed from a wire for wire bonding by means of a wire bonder, and include proximal ends wire-bonded to each corresponding conductive patterns on the insulating substrate, and free ends formed by being cut after the wire is wire-bonded to a dummy substrate.
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