| 摘要 |
PROBLEM TO BE SOLVED: To provide an LED device which can minimize generation of such disadvantages that lead cutting or lead forming in its manufacturing processes causes peeling off of lead terminals from a reflecting casing made of resin, and also to provide a method for manufacturing the LED device. SOLUTION: An LED device 12 has a box-like bottomed reflecting casing 16 of a longitudinal rectangular shape as viewed from its front side. The casing 16 has a bottom wall and frame walls 16a and 16b forwardly extended from the bottom wall and is open at its front side. Disposed on the bottom of the reflecting casing 16 are a plurality of terminal plates 18, 19 and 20, to which a predetermined number of LED chips 17 are bonded. Present in the reflecting casing 16 are leads 22 and 27 extended from the terminal plates 18 to 20 and reaching outer surfaces of the frame walls. Formed on the inner sides of the frame walls 16a and 16b of the casing 16 at sites corresponding to the remaining leads 22 and 27 are expansions 29. |
