| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for producing a multilayered printed wiring board of build-up type comprising alternately piled conductor circuit layers and insulating layers, enabling to easily form the conductor layers excellent in adhesiveness on the insulating layers in desired thicknesses, and suitable for fine patterns. SOLUTION: This thin metal layer-having interlayer adhesive film for a multilayered printed wiring board is produced by forming a metal layer having a thickness of 0.05-5μm by a vacuum deposition method, a sputtering method or an ion-plating method on a thermally flowable adhesive film layer having a thickness of 10-200μm and, if necessary, formed on a support base film. This transfer thin metal layer-having interlayer adhesive film for a multilayered printed wiring board is also produced by forming a thin metal film having a thickness of 0.05-5μm on a support base film by a vacuum deposition method, a sputtering method or an ion-plating method and subsequently forming a thermally flowable adhesive film having a thickness of 10-200μm on the formed thin metal layer. This multilayered printed wiring board is further produced by laminating the thin metal layer-having interlayer adhesive film to an inner layer circuit board and subsequently curing the adhesive layer. |
