发明名称 MANUFACTURE OF FLAT CIRCUIT BODY AND DIE FOR VACUUM FORMING
摘要 PROBLEM TO BE SOLVED: To solve a problem of air leakage at a time of vacuum forming and, at the same time, to pursue easy trimming. SOLUTION: In the event that a flat circuit body is manufactured by this method wherein two resin sheets 11, 12 are put into close joint with the circuit body 13 sandwiched therebetween by conducting vacuum forming with the flat-shaped circuit body 13 disposed on a first resin sheet 11 and with a second resin sheet 12 coveringly placed thereon, after the first resin sheet 11 is placed on a body 23 of a vacuum forming die 20, the circuit body 13 is disposed thereon while connectors 15 on terminals of the circuit body 13 are housed in recessed places 22 in a die surface 23a of the vacuum forming die 20. Thereafter, openings 22a of the recessed places 22 are closed with lid bodies 25 mounted on the body 23 with hinges 26, and, in this state, the second resin sheet 12 is coveringly placed on the circuit body 13 and the lid bodies 25, and then vacuum forming is conducted, and thereby two resin sheets 11, 12 are jointed.
申请公布号 JPH09298017(A) 申请公布日期 1997.11.18
申请号 JP19960111665 申请日期 1996.05.02
申请人 YAZAKI CORP 发明人 KITADA MASASHI
分类号 B60R16/02;H01B13/00;H01B13/012 主分类号 B60R16/02
代理机构 代理人
主权项
地址