| 摘要 |
<p>PROBLEM TO BE SOLVED: To prevent stray capacitance from being formed in circuits by forming a grounded third conductor pattern layer facing the opposite surface of a second conductor pattern layer to a circuit pattern of a first conductor pattern layer; the second layer having insulation regions facing at this circuit pattern. SOLUTION: The printed wiring board 50 mounts circuit parts 6 on parts mounting faces 51, 52 of the surfaces of boards. The mounting faces 51, 52 and conductor earth layers 53, 54 are laminated through insulative epoxy resin layers inserted therebetween to form a laminate structure printed wiring board. On one parts mounting face 51 the parts 6 are connected through conductors to a circuit pattern 6A to form VCO circuits. The lower earth layer 53 facing the circuit pattern 6A through an epoxy material forms insulation regions 53A by removing the conductor pattern at areas facing the VCO circuits 22.</p> |
