| 摘要 |
<p>PROBLEM TO BE SOLVED: To restrain chemical liquid from adhering to a thin plate support and to make a thin plate support high enough in strength by a method wherein thin plate support pawls provided with parallel supporting cutouts where the peripheral edges of the thin plates are fitted to be supported and a thin plate support pad are integrally molded with synthetic resin into a hollow molded body. SOLUTION: A thin plate support pawl 2 which transfers semiconductor wafers provided in parallel supporting then at the same time is equipped with a support pad 3 which supports the semiconductor wafers. The thin plate support pad 3 is dipped into a chemical liquid tank or a pure water tank, and a large number of, semiconductor wafers transferred by a pair of thin plate support pawls are supported as dipped into the chemical liquid tank. Supporting cutouts 17 in which the peripheral edges of semiconductor wafers are fitted to be supported are provided in four support rods 14 provided to the thin plate pad 3. The thin plate support pawl 2 and the thin plate support pad 3 are molded into a hollow molded member by injecting gas into a molding die together with synthetic resin through a nozzle.</p> |
